Three major classifications and applications of thermally conductive silicone

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Thermally conductive silicone in electronic and electrical appliances on the application of more, mainly used in the heat-generating components of the thermal conductivity and heat dissipation function, because the ordinary thermal conductive silicone its performance depends on its doping aluminium hydroxide composition, however, there are also special thermally conductive silicone will be doped with a certain amount of precious metal oxides. Then, thermal conductive silicone will be used in the occasion can be divided into three major state classification: grease (thermally conductive silicone grease), paste (thermally conductive paste) and patch (thermally conductive gasket) three.

Greasy (thermally conductive silicone grease) is one of the three states of thermal conductivity can be said to be the highest, thermally conductive silicone grease is paste-like, viscous, non-drying, generally can be used for more than four years. Thermally conductive silicone grease is mainly used to fill the gap between the CPU and the heatsink material, this material is known in the industry as thermal interface materials. It serves to conduct the heat emitted by the CPU to the heat sink, so that the CPU temperature is maintained at a level that can work stably, effectively preventing the CPU from being destroyed because of poor heat dissipation, but also prolong the use of life. In the heat sink and to the hot air parts in his two surfaces even if the two planes are smooth, in the encounter contact will appear gap, and the gap in the air is a bad medium of thermal conductivity, will seriously hinder the heat to the heat sink conduction, this time thermal silicone grease comes into play, play its due role.

Paste (thermal paste) belongs to the thermal interface materials, room temperature can be cured a gel, the colour is white or black, it needs to react with the water vapor in the air to be cured, thermal paste and thermal grease is the biggest difference is that the thermal paste can be cured, cured after a certain degree of elasticity, adhesion and extensibility, while the thermal paste has a fixed and bonding properties, so it meets the general process of sealing, in the rate of thermal conductivity, the paste is just the same as the heat conduction rate, and the thermal paste is just the same as the thermal paste. Paste is just the opposite of thermally conductive silicone grease, it is the lowest thermal conductivity of a kind, so it is generally used in capacitance resistance and other parts of the thermal conductivity.

Patch (thermally conductive gasket) cost is relatively low, it has easy to replace, non-drying and other characteristics, generally applicable to ordinary devices easy to process. On the side of the battery is generally affixed with a thermally conductive gasket, used to fill the gap between the battery and the shell, but also can play a buffer, solid role, due to the thermal conductivity of this material is relatively small, is generally not applicable to high-end electronic products (eg: computer CPU).